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  • Grant-Funded Project Holo-Cam

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Holo-Cam

Ultra-miniaturized holographic 3D camera for medical 3D endoscopy

Currently, medical diagnostics using 3D endoscopy rely on rather expensive and complex equipment. The miniaturization of optoelectronic 3D camera modules for microscopic 3D scanning of tissues or organs is being made possible within the scope of this collaborative project with the aid of digital optical holography, an extension of known interference techniques such as OCT (Optical Coherence Tomography) or interference microscopy. The advantages of this holographic approach lie in the high accuracy of the measurement and the automatic algorithmic focusing across all areas of the 3D object.

There will be entirely new application opportunities for such mini-modules in 3D endoscopes and other applications that remain fundamentally inaccessible to „classic“ 3D cameras. These include high microscopic resolution in all three dimensions, the elimination of mechanical refocusing, as well as the ability to „see“ beneath the surface. The anticipated price reductions upon later market entry, driven by lower material consumption and further economies of scale, will further propel this novel technology.

The first area of application is the medical field. However, the industrial sector also offers many opportunities for the use of an ultra-miniaturized 3D camera.

Objective:

In this joint project, various technological disciplines are brought together for an ultra-miniaturized 3D camera module. The key components consist of laser optics, ultra-miniaturized optics and lighting technology. The goal is the „chip-in-tip“ integration of the 3D camera module into various endoscope tips (including flexible ones) with a diameter of just a few millimeters.

Our contribution:

Evaluation of ultra-miniaturized, ultra-low-power camera electronics and an evaluation unit

  • Development of two highly compact electronics boards for reading out the camera chips, incorporating the latest PCB design strategies
  • Connection of the camera and evaluation electronics to a low-power, high-speed optical and electrical link
  • Support regarding signal integrity for maximum data transfer rates
  • New concepts for the ultra-miniaturized interconnection of mini laser diode modules

Other partners from industry and research:

AKmira optronics GmbH, Potsdam

AIXEMTEC GmbH, Herzogenrath

Nanoplus Nanosystems and Technologies GmbH, Meininigen

KARL STORZ SE & Co. KG, Tuttlingen

Septosurvive is sponsored by the Bundesministerium für Forschung und Entwicklung.

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