proFRAME Base Board 3.0 CompactPCI Serial

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0,00 €

Categories: proFRAME 3.0, proFRAME Base Boards

The third generation of proFRAME base boards made its debut in CompactPCI® Serial (CPCI-S.0) form, offering four times the data rates of its predecessor to support state-of-the-art automotive cameras.

The Base Board is built around a AMD Zynq™ UltraScale+™ ZU4CG MPSoC, enabling increased data transfer rates of up to 40 Gbit/s for each of its new-type camera adapter interfaces.

The corresponding camAD3 adapter modules take advantage of this, offering up to four camera inputs or outputs on a single adapter. proFRAME 3.0 adapters using GMSL2™, GMSL3™, FPD-Link™ III and FPD-Link™ IV (de)serializers are available or currently in development.

2× camAD3 camera adapter interfaces, each max. 40 Gbit/s video data interface
- 4× CSI-2® interfaces 4 lanes each up to 2.5 Gbit/s.
  Total 40 Gbit/s or
  23× LVDS data lanes each up to 1.6 Gbit/s.
  Total 36.8 Gbit/s
- 4× I²C interface (1 MBaud) to serializer and deserializer chips
- 1× I²C interface to internal devices
  (e.g., EEPROM, interface FPGAs, PoC pot, …)
- 1× SPI interface to serializer and deserializer chips
- 5 to 24V supply for Power over Coax (PoC)
- FSYNC trigger, interrupt, reference clock and other
  GPIO signals
PCIe® x8 Gen3 interface (64 Gbit/s) to CompactPCI® Serial backplane
AMD Zynq™ UltraScale+™ ZU4CG MPSoC (FBVB900)
Processing subsystem: Dual-core Arm® Cortex™-A53 MPCore™ up to 1.3 GHz
2 GB DDR4 of PS (processing system) memory, up to 150 Gbit/s
CompactPCI® Serial (CPCI-S.0) 3U form factor
Temperature range: −20 to +85 °C