proFRAME Base Board 3.0 CompactPCI Serial

The third generation of proFRAME base boards made its debut in CompactPCI® Serial (CPCI-S.0) form, offering four times the data rates of its predecessor to support state-of-the-art automotive cameras.

The Base Board is built around a AMD Zynq™ UltraScale+™ ZU4CG MPSoC, enabling increased data transfer rates of up to 40 Gbit/s for each of its new-type camera adapter interfaces.

The corresponding camAD3 adapter modules take advantage of this, offering up to four camera inputs or outputs on a single adapter. proFRAME 3.0 adapters using GMSL2™, GMSL3™, FPD-Link™ III and FPD-Link™ IV (de)serializers are available or currently in development.

  • 2× camAD3 camera adapter interfaces, each max. 40 Gbit/s video data interface
    • 4× CSI-2® interfaces 4 lanes each up to 2.5 Gbit/s.
      Total 40 Gbit/s or
      23× LVDS data lanes each up to 1.6 Gbit/s.
      Total 36.8 Gbit/s
    • 4× I2C interface (1 MBaud) to serializer and deserializer chips
    • 1× I2C interface to internal devices
      (e.g., EEPROM, interface FPGAs, PoC pot, …)
    • 1× SPI interface to serializer and deserializer chips
    • 5 to 24V supply for Power over Coax (PoC)
    • FSYNC trigger, interrupt, reference clock and other
      GPIO signals
  • PCIe® x8 Gen3 interface (64 Gbit/s) to CompactPCI® Serial backplane
  • AMD Zynq™ UltraScale+™ ZU4CG MPSoC (FBVB900)
  • Processing subsystem: Dual-core ARM® Cortex™-A53 MPCore™ up to 1.3 GHz
  • 2 GB DDR4 of PS (processing system) memory, up to 150 Gbit/s
  • CompactPCI® Serial (CPCI-S.0) 3U form factor
  • Temperature range: −20 to +85 °C